Blind Vias / Buried Vias -- Laser Drilled Via, PCB Vias

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Blind / Buried Vias

Definition of Laser Drilled Blind and Buried Via
Blind Vias are defined as those vias that start on an outer layer but terminate on an inner layer. Buried Vias are defined as those vias that exist only between inner layers and do not begin or terminate on an outer layer.

Applications for Blind and Buried Vias
Blind and buried vias help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today’s fine pitch BGA and flip-chip component footprints do not allow for running traces and through. Instead, the blind and buried vias will only connect those layers that are required to have a connection in that specific area, allowing for PCB real estate space savings.

Common Issues / Saturn Solutions for Blind and Buried Vias
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