Blind Via / Via in Pad / Fine Pitch BGA

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Blind Via / Via in Pad / Fine Pitch BGA PCB
Layer Count	10
Copper Weight	1/2oz
Min Line / Space	4/4
Final Finish	ENIG
Additional Details	Blind Vias L9-L10, Via-in-Pad, Fine Pitch BGA

Blind-Via-VIP-FinePitchBGA-Close-Up

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Technologies Used:
Blind / Buried Vias
Via-in-Pad
Fine Lines and Spacing