Printed Circuit Board Manufacturing Capabilities

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Capabilities

Capacity

Printed Circuit Board Manufacturing Capabilities

Saturn’s PCB manufacturing capabilities are among the Industry Leaders and continue to grow year-by-year at rapid rate.

Customer Driven Technological Capability
If there is a demand for a given process, Saturn will make the necessary investments to add capability.

PCB Capabilities at a Glance
Layer Count	1 - 24+
Largest Panel Size	18" x 24"
Smallest Circuit Width/Spacing	.004 mils, 3 mils proto
Material Types	FR-4, FR406HR, PTFE, Polyimide, Metal Core / Heatsinks
Smallest Mech. Drilled Hole	.006"
Hole Size & Dimensional Tolerances	+/- .003" amd +/- .002"
Finishes / Lead Free Finishes	HASL, Immersion Silver/Gold, Deep Gold, Pb-Free HASL
Electrical Testing	Flying Probe & Bed of Nails
Fabrication	Routing, Blanking & Scoring
Plasma Processing Unit	Teflon Activation, Etch Back, Desmear
Laser	Drilling, Routing and Trimming

Printed Circuit Production Capabilities

BARE PCB MATERIALS

Feature	Current Capability	Future Capabilities
Laminate Nominal Tg	260° C	260° C
Laminate Nominal Td	N/A	350° C
Maximum Layer Count	24	24
Min. Finished Thickness	.014"	.014"
Min. Core Thickness	.005"	.004" - .002"
Maximum Panel Size	18" x 24"	20" x 24"

PWB FABRICATION

Feature	Current Capability	Future Capabilities
Minimum Finished Hole Size	.006"	.006"
Blind/Buried Vias	.006"	.003" - .002"
Routed Part Tolerance	.005"	.005"
Scoring Tolerances	.003"	.003"

CIRCUIT BOARD IMAGING

Feature	Current Capability	Future Capabilities
Minimum Lines/Spaces	.004"	.003" - .002"
Min. Quad Flat Pack Pitch	.016"	.016" - .012"
Minimum Pad Size	.005"	.005" - .004"
Soldermask Registration	.003"	.002"
Soldermask Tolerance	.002"	.002"

PC BOARD PLATING & SURFACE FINISHES

Feature	Current Capability	Future Capability
Finished Copper Thickness	20 ounce	20 ounce
Hot Air Solder Leveling	Yes	Yes
Lead-Free Solder (HAL)	Yes	Yes
Full Body Hard Ni/AU	Yes	Yes
Immersion Gold/Silver	Yes	Yes