| |
Our technological capability is totally
customer driven. If we have the demand for a given process,
we will make the necessary investments to add capability.
| Feature |
Current Capability |
Year 2007 |
Year 2008 |
Todays Products |
| Laminate Nominal Tg |
260°C |
260°C |
260°C |
CEM-1
/ CEM-3 |
| Laminate Nominal Td |
350°C |
350°C |
350°C |
FR4 / FR406 |
| Maximum Layer Count |
24+ |
24+ |
24+ |
Pb Free
IS-410 |
| Min Finished Thickness
|
.014 |
.014 |
.014 |
Rogers |
| Min. Core Thickness |
.004 |
.003 |
.002 |
Taconic |
| Maximum Panel Size |
18 X 24
|
18 X 24
|
18 X 24
|
Arlon |
Material / Design Types:
Aluminum Core; Heavy Copper Multilayer; Cavity Boards, PTFE
& PTFE Hybrids; Heatsinks
| Feature |
Current Capability |
Year 2007 |
Year 2008 |
Todays Products |
| Minimum finished hole size |
.004 |
.003 |
.002 |
Drilling |
| Blind/Buried Vias |
.004 |
.002 |
.002 |
Laser Drilling |
| Routed Part Tolerance |
+/-.005
|
+/-.005
|
+/- .005
|
Routing |
| Scoring Tolerances |
+/- .005
|
+/- .005
|
+/- .005
|
Scoring |
Other current capabilities:
Depth-Control Routing; Laser Routing; Skiving
Laser Drilling
| Feature |
Current
Capability
|
Year
2007 |
Year
2008 |
Todays
Products |
| Minimum Lines/Spaces |
.004 |
.003 |
.002 |
Photo Print |
| Min. Quad Flat Pack Pitch |
.016 |
.016 |
.012 |
Silver Plugged
Hole |
| Minimum Pad Size |
.005/side |
.005/side |
.004/side |
Peelable
Mask |
| Solder Mask Registration |
.003 |
.002 |
.002 |
|
Other current capabilities:
Collimated Imaging for Soldermask for enhanced registration
and holding small dams between SMT pads
| Feature |
Current Capability |
Year 2007 |
Year 2008 |
Todays Products |
| Finished Copper Thickness
|
12
ounce |
Pattern Plate |
| Sn/Pb HASL |
Yes |
Gold Fingers |
| Pb Free HASL (SnNiCu) |
Yes |
|
| Immersion Gold |
Yes |
|
| Immersion Silver |
Yes |
|
| Immersion Tin |
Yes |
|
| Full Body Deep Gold |
Yes |
|
| Apply to plate vias shut |
No |
Yes |
Yes |
|
|
|
Advantages |
Facilities |
Equipment List |
Capacity |
Capabilities/Technology Roadmap |
