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Capabilities
Capacity
Reliability
Technology Roadmap



Manufacturing Capabilities
Layer Count 1 – 26+
Largest Panel Size 18″ x 24″
Min Circuit Width / Space .004 mils, 3 mils proto
Material Types FR-4
PTFE
Polyimide
Metal Core / Heatsink
Min Mechanical Drilled Hole .003″
Hole and Dimensional Tolerances +/- .003″ and +/- .002″
In-House Finishes HASL
Lead Free HASL
Immersion Silver / Gold / Tin
Hard Gold (Full Body)
ENIG
OSP
Electrical Testing Flying Probe
Bed of Nails
Fabrication Routing
Beveling
Scoring
Plasma Processing Unit Teflon Activation
Etch Back
Desmear
Laser Drilling
Routing
Trimming
Barcoding and Serialization Both human readable and barcode





PCB MATERIALS
Feature Current Capability Future Capabilities
Laminate Nominal Tg 260° C 260° C
Laminate Nominal Td N/A 350° C
Maximum Layer Count 26+ 26+
Min. Finished Thickness .014" .014"
Min. Core Thickness .004" .003" - .002"
Maximum Panel Size 18" x 24" 30" x 30"


PCB FABRICATION
Feature Current Capability Future Capabilities
Minimum Finished Hole Size .006" .006"
Blind / Buried Vias .006" .003" - .002"
Routed Part Tolerance .005" .005"
Scoring Tolerances .005" .005"


IMAGING
Feature Current Capability Future Capabilities
Minimum Lines / Spaces .004" .003" - .002"
Min. Quad Flat Pack Pitch .016" .016" - .012"
Minimum Pad Size .005" .005" - .004"
Soldermask Registration .003" .002"
Annular Ring .005" (IPC Class 3) .003" - 0.005"