PCB Roadmap
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| PCB CAPABILITIES AT A GLANCE |
| Layer Count |
1 - 24+ |
| Largest Panel Size |
18" x 24" |
| Min. Circuit Width / Spacing |
.004 mils, 3 mils proto |
| Material Types |
FR-4, FR406HR, PTFE, Polyimide, Metal Core / Heatsink |
| Min. Mech. Drilled Hole |
.006" |
| Hole & Dim. Tolerances |
+/- .003" and +/- .002" |
| Finishes |
HASL, Immersion Silver/Gold, Deep Gold |
| Lead Free Finishes |
Pb-Free HASL |
| Electrical Testing |
Flying Probe & Bed of Nails |
| Fabrication |
Routing, Blanking & Scoring |
| Plasma Processing Unit |
Teflon Activation, Etch Back, Desmear |
| Laser |
Drilling, Routing and Trimming |
Production Capabilities (CAP)
SEC is a proven technology leader. We feature the following technology offering.
MATERIALS
| Feature |
Current CAP |
Future CAP |
| Laminate Nominal Tg |
260° C |
260° C |
| Laminate Nominal Td |
N/A |
350° C |
| Maximum Layer Count |
24 |
24 |
| Min. Finished Thickness |
.014" |
.014" |
| Min. Core Thickness |
.005" |
.004" - .002" |
| Maximum Panel Size |
18" x 24" |
20" x 24" |
FABRICATION
| Feature |
Current CAP |
Future CAP |
| Min Finished Hole Size |
.006" |
.006" |
| Blind / Buried Vias |
.006" |
.003" - .002" |
| Routed Part Tolerance |
.005" |
.005" |
| Scoring Tolerances |
.003" |
.003" |
IMAGING
| Feature |
Current CAP |
Future CAP |
| Min Lines / Spaces |
.004" |
.003" - .002" |
| Min. Quad Flat Pack Pitch |
.016" |
.016" - .012" |
| Min Pad Size |
.005" |
.005" - .004" |
| Soldermask Registration |
.003" |
.002" |
| Soldermask Tolerance |
.002" |
.002" |
PLATING & SURFACE FINISHES
| Feature |
Current CAP |
Future CAP |
| Finished Copper Thickness |
20 ounce |
20 ounce |
| Hot Air Solder Leveling |
Yes |
Yes |
| Lead-Free Solder (HAL) |
Yes |
Yes |
| Full Body Hard Ni/AU |
Yes |
Yes |
| Immersion Gold/Silver |
Yes |
Yes |
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