| Process
Description |
Industry Standard |
Saturn
Electronics |
| 1. |
Copper Laminate (base
material) |
Standard sheet sizes
that are sheared to size in-house. |
Standard panel sizes
with saw-cut edges.
This significantly reduces contamination in subsequent processes
(e.g., imaging, testing, etc.) |
| 2. |
Drilling |
Drilling machine that
requires tools to be changed manually. Maximum panel sizes are
typically 18” x 24”. |
Saturn’s lowest-end
drilling machines are Excellon Mark VI CNC drillers with Tool
Management System (TMS). TMS allows an operator to load all tools at
once into a cartridge, with the machine doing the rest of the work.
Saturn also has two Excellon Century 2001 drilling machines.
These machines are equipped with larger tables sizes that enable us
to drill panels up to 20" x 28". This will reduce handling per piece
in subsequent processes.
Also, these machines are equipped with automatic measurement
systems that measure drill bit length, diameter, spindle runout, and
broken drill bit detection. Essentially, these capabilities remove
the human element from these drilling issues, thereby minimizing the
chance of operator error. |
| 3. |
Image Room |
Enclosed room. |
Saturn has a Class
10,000 Clean Room. The environment in this room minimizes foreign
material from creating common shorts in the imaging process. Also,
strict temperature and humidity controls prevent distortion in the
customer artwork. |
| 4. |
Imaging / Exposure |
Customer artwork is
aligned manually by eyeballing the registration of the film to the
drilled panel. |
Saturn uses MultiLine equipped drawers for
imaging. MultiLine tooling removes the
human factor involved in lining up the
bottom film to the top film. This results in
significantly reduced off-registration issues.
Saturn also employs the use of an Olec AX-
28 automatic exposure unit that uses
cameras to align the top and bottom
artwork. This machine can hold registration
as tight as +/- .0005 mils front to back. |
| 5. |
Plating Through Holes
(PTH) |
Manual dip tanks. |
Saturn employs two automatic electroplating
lines and, as such, PTH is a two-step
process.
Saturn has built a custom automatic plating
line that has been designed and constructed
primarily in-house. The intent was to
minimize plating variation, which is the
main goal of production plating. This was accomplished by including the following:
1. It houses racks that only allow
panels to be plated one-high.
2. Anode-to-anode distance is 28
inches (maximum allowable distance
for plating).
3. Water-submerged positive cathode
contact.
4. Chemical-submerged anode bars for
positive contact.
5. Eductor system. This utilizes a highvolume
chemical flow parallel to the
panels instead of air to accomplish
chemical agitation.
6. Mechanical agitation to allow
chemical to flow through holes.
7. Dual-sided rectification to equalize
copper plating from one side of the
rack to the other.
8.State-of-the-art rectifiers (two per
rack) with 0.5% maximum ripple
effect.
9. Panels are now being plated at 17
amps per square feet (ASF), versus
an industry standard of 30 ASF.
This will result in more uniform
plating, albeit lowered production.
10. High ductile plating process that
meets C7000 specs for 1,000 hour
cycle tests.
11. Chemistry has been revised so that
high-aspect ratio plating can be
performed. Both lines are calibrated
to plate 10:1 aspect ratio as a
standard. |
| 6. |
Strip-Etch-Strip |
Conveyorized line
that is capable of producing 7 mil line/spacing. |
Saturn has combined
all three steps into one conveyorized line. Saturn is capable of
producing 5 mil line/spacing in production quantities. |
| 7. |
Cleaning prior to LPI |
Manual dip tanks or
small conveyorized chemical cleaning line. |
Instead of using a
chemical cleaning process that may increase ionic contamination and
compromise the surface finish, Saturn utilizes a Pumice Scrubber to
clean boards prior to LPI. This process uses a volcanic ash mixture
and soft nylon brushes to remove copper oxidation. |
| 8. |
Liquid Photo-Imageable
Soldermask |
Manual tables or
AutoRoll machines. |
Saturn uses 4 DP- model LPI applicators to
be used in lieu of AutoRoll soldermask
applicators. For standard products, Saturn
also employs the use of an Argus spray
coating machine. This will result in less
soldermask within holes and eliminates
dimple marks on the board surface. |
| 9. |
LPI Image |
Customer artwork is
aligned manually by eyeballing the registration of the film to the
drilled panel. |
Saturn uses MultiLine equipped drawers for
imaging. MultiLine tooling removes the
human factor involved in lining up the
bottom film to the top film. This results in significantly reduced off-registration issues. |
| 10. |
LPI Developing |
Standard conveyor
that is separated from baking and cleaning lines. |
Saturn has
conveyorizing the developing, final baking, and cleaning processes
into a single production line. This should improve quality through
reduced handling and utilizing higher-end machinery.
Our developing line is constructed of a single-chamber, stainless
steel developing line. |
| 11. |
Final Baking |
Manual conventional
ovens (usually Grieve model). |
Saturn has installed
a Bassi Tunnel oven to perform final baking. Since heat is uniformly
applied to the boards and the machine controls the cycle time,
quality is improved dramatically. |
| 12. |
Cleaning |
Manual dip tanks. |
Saturn has a Chemcut
XL547 conveyorized cleaning line. XL547 model is the latest Chemcut
equipment line. |
| 13. |
Hot Air Solder
Leveling (HASL) |
Vertical HASL. |
Saturn has both
vertical and horizontal HASL processes. The horizontal HASL allows
Saturn to offer fine pitch SMT, even tin-lead thickness, and a
flatter finish. |
| 14. |
HASL Post-cleaner |
LPI Cleaning line is
also used as a post-cleaner. |
Saturn has custom
fabricated a high-pressure, high-temperature post-cleaner for use
after the HASL process. This is a stainless steel post-cleaner
unit that runs at 150°F, sprays regular and D.I. water at 1 to 1.5
gallons per minute at 50 psi using 7.5 HP pumps (1/2 gallon per
minute, 20-30 p.s.i., 1.5 HP is the best available on the market).
Furthermore, the cleaner uses 8-1” wide toothbrush-type agitating
brushes versus an industry best of 4-0.5” brushes. This custom
process has been proven to remove ionic contamination from the
surface of PCBs to well below industry standards. |
| 15. |
Inspection |
Visual inspection by
personnel using a light table. |
Saturn augments its
visual inspection process by utilizing visual inspection equipment.
This equipment (hole checker) checks for holes that have been
plugged by the HASL and LPI processes, incorrectly plated or
non-plated holes, and drilled with incorrect drill bit sizes. |
| 16. |
Electrical Testing |
Either clam shell
tester or single flying probe. |
Saturn offers a variety of testing
alternatives.
First, Saturn has 5 Mania double-sided
testing machines.
The fixture cost for these testers is half the
cost or less than those used in more
traditional clam shell testers since we build everything in-house.
Also, Saturn utilizes six flying probe testers
for smaller and prototype orders. This
allows the customer to forego the cost of a
hard testing fixture and, instead, pay a
modest testing fee. |
| 17. |
Cleaning after
Routing |
Washer using city
water. |
Saturn has installed
a washer in its shipping department that uses de-ionized (D.I.)
water to clean the boards. D.I. water results in a cleaner board,
but more importantly it further removes ionic contamination that may
have occurred after HASL. |
| 18. |
Duplicate Processes |
Due to cost
constraints, many PCB shops will not have duplicate processes. |
All of Saturn’s
processes incorporate duplicate equipment so that in the case of an
equipment failure, Saturn’s production capabilities will not be
compromised.
Furthermore, Saturn has controlling interests in four other PCB
facilities so that in the event of a catastrophic event, the supply
chain will not be compromised. |
| 19. |
Advanced Capabilities |
Minimal /
Outsourced |
Saturn has grown from a technology
standpoint exponentially since 2003. Inhouse
capabilities include laser drilling,
laser routing, PTFE plasma preparation,
Plasma treatment and etchback, and special
project groups to assist customers with critical and technologically demanding
products. |
| 20. |
Minimum Hole Size |
.015” |
.002” |
| 21. |
Minimum Line/Spacing |
.007” / .007” |
.003” / .003” |
| 22. |
Surface Finishes |
HASL |
HASL; Lead-Free HASL; Immersion Tin,
Silver, Gold |
| 23. |
Quality Certification |
No certification is
viewed as standard. |
ISO 9000, TS16949, Delphi C7000,
ISO14000 |
| 24. |
Financial Liabilities |
No standards
available. |
$ 0 Bank Debt
$ 0 Accounts Payable
$ 0 Lease obligations |