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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
18GHz Microwave PCB with Cavity



Cavity PTFE
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Technologies Used
PTFE/Hybrid Technologies
Fine Lines and Spacing
Controlled Impedance Designs
Cavity Boards
Via-in-Pad
Blind / Buried Vias



18GHz Microwave PCB with cavity
Layer Count 10
Copper Weight 1/2oz
Min Line / Space n/a
Final Finish Soft, Wire-Bondable Gold
Additional Details Buried Vias L1-L2,L1-L4,L5-L6,L5-L8,L1-L8: Cavity L1-L5. RF Microwave Application