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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Fine Pitch BGA



Fine Pitch BGA
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Technologies Used
Blind / Buried Vias
Via-in-Pad
Fine Lines and Spacing






Fine Pitch BGA
Layer Count 10
Copper Weight 1/2oz
Min Line / Space 4/4
Final Finish ENIG
Additional Details Blind Vias L9-L10, Via-in-Pad, Fine Pitch BGA