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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Multilayer PCB

Multilayer Registration Control

PREDICTION: LAYER-TO-LAYER ALIGNMENT

One primary characteristic is layer to layer alignment. In addition to our MultiLine tooling systems, we have purchased and implemented the use of the PerfecTest system to fine tune our process and achieve highly accurate scale factor predictions for a variety of material types and core thickness.

Multilayer Imaging

CRITICAL FINE LINE RESOLUTIONS

Saturn has purchased and installed four Olec AT-30 automatic alignment exposure units. These units use four cameras to align artwork top to bottom, and then use panel motion systems to automatically adjust the panel position to a best fit to the artwork. Furthermore, these units have hybrid-collimated light units that ensure exposure light attacks the panel at 90 degree angles to the artwork, which is critical for fine line resolutions.

Microvia Drilling

MICROVIA FORMATION CAPABILITIES

We have installed advanced PCB drilling systems (Excellon Century 2001 and Mania Micronics 86) capable of up to 180k RPM spindle speed, which is critical for microvia formation. Furthermore, our advanced systems use linear motion technology for X, Y, and Z axis motion. This results in not only a higher throughput, but also increased registration accuracy.

Production Plating

STANDARD PRODUCTION & BLIND MICROVIAS

Saturn has built a custom automatic PCB plating line that has been designed and constructed primarily in-house. The intent was to minimize plating variation, which is the main goal of production plating. To address issues with plating small and blind holes we use mechanical agitation to allow chemical to flow through holes and vibration to remove air from microvias and blind microvias.

PCB Etching

2 MIL LINE & SPACING

Saturn has installed a new Hollmuller SES line. This line incorporates the latest in spray technology that minimizes chemical puddling. This is line capable to accurately and uniformly etch down to 2 mil lines and spaces.