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Fine Lines & Spacing
Controlled Impedance Designs
Heavy Copper PCB
PTFE / Hybrid Technologies
Cavity Boards
Internal-Cavity Boards
Thermal Management PCB
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating / Castellation
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Multilayer PCB

PCB Fabrication Process Flowchart
Check out our Multilayer PCB Flowchart.

For additional advanced circuit board technologies, check out our Multilayer PCB Products page. 

Circuit Board Technology for Critical Manufacturing Points
We have increased our production capable layer count exponentially since 2002. With multi-layer PCBtechnology there are many critical manufacturing points that need to be addressed. 

Multilayer Registration Control
Prediction: Layer-to-Layer Alignment
One primary characteristic is layer to layer alignment. In addition to our MultiLine tooling systems, we have purchased and implemented the use of the 
PerfecTest system to fine tune our process and achieve highly accurate scale factor predictions for a variety of material types and core thickness. 

Multilayer Imaging
Saturn has purchased and installed four Olec AT-30 automatic alignment exposure units. These units use four cameras to align artwork top to bottom, and then use panel motion systems to automatically adjust the panel position to a best fit to the artwork. Furthermore, these units have hybrid-collimated light units that ensure exposure light attacks the panel at 90 degree angles to the artwork, which is critical for fine line resolutions. 

Microvia Drilling 
Microvia Formation Capabilities
We have installed advanced 
PCB drilling systems (Excellon Century 2001 and Mania Micronics 86) capable of up to 180k RPM spindle speed, which is critical for microvia formation. Furthermore, our advanced systems use linear motion technology for X, Y, and Z axis motion. This results in not only a higher throughput, but also increased registration accuracy. 

Production Plating 
Standard Production and Blind Microvias
Saturn has built a custom automatic 
PCB plating line that has been designed and constructed primarily in-house. The intent was to minimize plating variation, which is the main goal of production plating. To address issues with plating small and blind holes we use mechanical agitation to allow chemical to flow through holes and vibration to remove air from microvias and blind microvias. 

PCB Etching 
2 Mil Line & Spacing
Saturn has installed a new Hollmuller SES line. This line incorporates the latest in spray technology that minimizes chemical puddling. This is line capable to accurately and uniformly etch down to 2 mil lines and spaces. 

Multilayer PCB Prototypes 
Production Quality Multi-layer Boards
Saturn builds complex 
quick turn prototypes to production standards per IPC Class III and high reliability testing. 

Multilayer Lamination
5,000 square foot expansion houses 3 10-opening Burkle PC-controlled lamination system.  SEC has the most automated Multilayer Lamination room in North American Printed Circuit Board Fabrication.  Take a quick tour of our Multilayer Lamination Room. 

 

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