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IPC 4761 Via Plugging

The purpose of IPC-4761 is to provide PCB Designers, Fabricators and Assemblers with the latest information for protecting circuit board vias.


Bumped Via Protection

Hole plugging that protrudes above the surface.

Dimpled Via Protection

Fill material recedes below the hole interface.

Planarized Via Protection

Excess hole plugging or fill material protrude above the hole interface is removed.

Via Plugging Guideline

Technical article summarizing IPC-4761 specification, describing the via plugging process, and addressing the concerns of certain types of via plugs.

IPC-4761 Via Plugging Guideline

Summary chart of the different types of via plugs called.
Via Plugging Guideline