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New Material Yields 800x Thermal Conductivity for LED Applications
New thermal management PCB solution will be unveiled at IPC APEX 2010
Newly established joint venture that includes Saturn Electronics Corporation is in the process of finalizing development
of a specially-constructed LED packaging solution that will replace traditional metal core or
aluminum PCB substrates.
The innovative solution contains
thermal conductivity properties that are up to 4x the thermal conductivity of pure copper,
which has up to 200x thermal conductivity of current "premium" thermal management dielectrics.
Saturn Electronics will be in Booth 1628 at
IPC Las Vegas.
Contact Saturn directly at 734.941.8100
Email jim@saturnelectronics.com
for more information on this game-changing technology.
Dispersing Heat with Graphite
Yash Sutariya, VP of Saturn Electronics Corporation, discusses the thermal packaging solution that combines the heat dissipation benefits of the graphite material with the mechanical benefits of FR-4, resulting in a cost effective mounting material.
Watch the Real Time With...IPC interview
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