PCB Vias, Via in Pad, Plugged Vias

CAPABILITIES | TECHNOLOGY HUB | CUSTOMER SERVICE & SUPPORT | PRESS ROOM | PRODUCTS

Home > Products / Capabilities > Via-in-Pad

Fine Lines & Spacing

Controlled Impedance Designs

Heavy Copper PCB

PTFE / Hybrid Technologies

Cavity Boards

Internal-Cavity Boards

Thermal Management PCB

Via-in-Pad

Blind / Buried Vias

Multilayer

Edge Plating / Castellation

Via-in-Pad PCB Technology

Definition for Via in Pad
Various definitions of plugged vias / via-in-pad can be found in IPC-4671. Typically, though, via in pad refers to a via that is plated through and then filled with a conductive (or non-conductive) epoxy plugging ink. The ink is then planarized to create a flat surface and plated over. Most commonly, this via will eventually be patterned into an SMT or BGA pad so that it can be directly soldered to.

Applications for Plugged Vias
Via-in-Pad helps to save PCB real estate and also provides a direct conduit for heat transfer. Many of today’s fine pitch BGA and flip-chip component footprints do not allow for running traces and vias (typical “dog-bone” BGA configuration). Instead, the BGA pad, trace, and via are combined into one single feature allowing for 50% space savings. With the use of conductive inks, heat transfer away from critical components can be achieved. The ink is not only electrically conductive, but thermally conductive as well.

Common Issues / Saturn Solutions for PCB Vias
Click for detailed information Via-in-Pad Technology

Blind Via / Via in Pad / Fine Pitch BGA
Click on picture to proceed

Mouse over pictures below to see description

View our UL Certification