CAPABILITIES

Technology Roadmap



MFG CAPABILITIES
Layer Count 1 – 26+
Largest Panel Size 18″ x 24″
Min Circuit Width / Space 4 mils, 3 mils prototype
Material Types FR-4
PTFE
Polyimide
Metal Core / Heatsink
Min Mechanical Drilled Hole .003″
Hole & Dimensional Tolerances +/- .003″ and +/- .002″
In-House Finishes HASL
Pb-Free HASL
Immersion Silver
Immersion Gold
Immersion Tin

Hard Gold (Full Body)
ENIG
OSP
Electrical Testing Flying Probe
Bed of Nails
Fabrication Routing
Beveling
Scoring
Plasma Processing Unit Teflon Activation
Etch Back
Desmear
Laser Drilling
Routing
Trimming
Barcoding & Serialization Both human readable and barcode





PCB MATERIALS

Feature Current Capability Future Capabilities
Laminate Nominal Tg 260° C 260° C
Laminate Nominal Td n/a 350° C
Maximum Layer Count 26+ 26+
Min Finished Thickness .014" .014"
Min Core Thickness .004" .002"
Maximum Panel Size 18" x 24" 30" x 30"


PCB FABRICATION
Feature Current Capability Future Capabilities
Min Finished Hole Size  .006" .006"
Blind / Buried Vias .006" ..002"
Routed Part Tolerance .005" .005"
Scoring Tolerances .005" .005"


IMAGING
Feature Current Capability Future Capabilities
Min Lines / Spaces          .004" .002"
Min Quad Flat Pitch .016" .012"
Minimum Pad Size .005" .004"
Soldermask Reg .003" .002"
Annular Ring .005" .003"



About Us

Domestic PCB Fabricator

Saturn Electronics Corporation is a debt-free, domestic bare printed circuit board manufacturer providing cutting-edge solutions mandatory throughout design, assembly and fabrication.

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