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Technology Roadmap



MFG Capabilities
Layer Count 1 – 48+
Largest Panel Size 18″ x 24″
Min Circuit Width .004 mils, 3 mils proto
Material Types FR-4
FR406HR
PTFE
Polyimide
Metal Core / Heatsink
Min Mechanical Drilled Hole .003″
Hole & Dimensional Tolerance +/- .003″ and +/- .002″
Final Finishes HASL
Lead Free HASL
Immersion Silver
Immersion Gold
Immersion Tin
Deep Gold
ENIG
ENEPIG
OSP
Equipment Upgrades 2019 Combo X-Ray Drilling Machine 
Electrical Testing Flying Probe
Bed of Nails
Fabrication Routing
Beveling
Scoring
Plasma Processing Unit Teflon Activation
Etch Back
Desmear
Laser Drilling
Routing
Trimming
Barcoding & Serialization Human Readable
Barcode




MATERIALS
 
Feature                                       Current Future
Laminate Nominal Tg   260° C  260° C
Laminate Nominal Td   N/A  350° C
Maximum Layer Count   24  24
Min. Finished Thickness   .014″  .014″
Min. Core Thickness   .005″  .004″-.002″
Maximum Panel Size   18″ x 24″   20″ x 24″


FABRICATION

Feature                                       Current Future
Min Finished Hole Size   .006″ .006″
Blind/Buried Vias   .006″ .003″ – .002″
Routed Part Tolerance   .005″ .005″
Scoring Tolerances   .002″ .002″


IMAGING

Feature                                       Current Future
Min Lines/Spaces   .004″ .003″ – .002″
Min. Quad Flat Pack Pitch   .016″ .016″ – .012″
Min Pad Size   .005″ .005″ – .004″
Soldermask Registration   .003″ .002″
Soldermask Tolerance   .002″ .002″


PLATING & SURFACE FINISHES

Feature      Current Future
Finished Copper Thickness   20 oz   20 oz
Hot Air Solder Leveling   Yes   Yes
Lead-Free Solder (HAL)   Yes    Yes
Full Body Hard Ni/Au   Yes   Yes
Immersion Gold /Silver/Tin   Yes   Yes
OSP     Yes   Yes
About Us

Domestic PCB Fabricator

Saturn Electronics Corporation is a debt-free, domestic bare printed circuit board manufacturer providing cutting-edge solutions mandatory throughout design, assembly and fabrication.

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