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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
18GHz Microwave PCB with Cavity



Cavity PTFE
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Technologies Used
PTFE/Hybrid Technologies
Fine Lines and Spacing
Controlled Impedance Designs
Cavity Boards
Via-in-Pad
Blind / Buried Vias





18GHz MW PCB with Cavity
Layers 10
Copper Weight 1/2oz
Min Line / Space n/a
Final Finish Soft, Wire-Bondable Gold
Additional Details Buried Vias: L1-L2,L1-L4,L5-L6,L5-L8,L1-L8: Cavity L1-L5. RF Microwave Application