Saturn Electronics Logo
   
Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
18GHz Microwave PCB with Cavity


Via Impedance for MWRF
Layers 10
Cu Weight 1/2 oz
Application RF Microwave
Finish Soft, Wire-Bondable Gold
Buried Vias                           L1-2, L1-4, L5-6, L5-8, L1-8
Cavity L1-5
Additional Impedance Control
   





















Microwave PCB
Mouse over pictures below to see description

     


Technologies Used
PTFE/Hybrid Technologies
Fine Lines and Spacing
Controlled Impedance Designs
Cavity Boards
Via-in-Pad
Blind / Buried Vias