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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
24 Layer Sequential Lamination



24 Layers
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Technologies Used
Heavy Copper PCB
Blind / Buried Vias







24 Layer Sequential Lamination
Layer Count  24
Copper Weight 3 oz
Final Finish ENIG
Blind Vias 1-6, 19-24
Buried Vias 7-12, 13-18
Additional Vias second epoxy fill