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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
6 Mil Through Via


6 Mil Through Via PCB
Layers 8
Cu Weight 1.5oz
Min Ln / Sp 4/3 mil 
Finish ENIG
Additional Details 0.006" via through 0.062" w/5mil drill to inner layer trace spacing
















5 mil Inner Layer
Mouse over pictures below to see description

     


Technologies Used
Fine Lines and Spacing