Saturn Electronics Logo
Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Blind / Buried Vias
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
6 Mil Through Via

6 Mil Through Via PCB
Layers 8
Cu Weight 1.5oz
Min Ln / Sp 4/3 mil 
Finish ENIG
Additional Details 0.006" via through 0.062" w/5mil drill to inner layer trace spacing

5 mil Inner Layer
Mouse over pictures below to see description


Technologies Used
Fine Lines and Spacing