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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
Blind / Buried Vias

Definition

Blind Vias start on an outer layer but terminate on an inner layer. Buried Vias exist only between inner layers and do not begin or terminate on an outer layer. Blind and buried vias save real estate as features and lines are designed above or below them without making a connection. Today's fine pitch BGA and flip-chip component footprints do not allow for traces.

Applications

HDI will be critical to the automotive industry by reducing the size necessary for LiDAR PCBs for autonomous vehicles.

Via Fill and Any-Layer Via

HDI via fill plating process dramatically reduces the number of steps required while at the same time allowing for smaller circuit line and spacing. Combined with laser drilling, sequential lamination technology, and direct imaging, this plating process allows for the creation of Any-Layer Via technology.


New HDI sample circuit board: Copper Via Fill.


Fabrication Issues

HDI via fill plating process dramatically reduces the number of steps required while at the same time allowing for smaller circuit line and spacing. Combined with laser drilling, sequential lamination technology, and direct imaging, this plating process allows for the creation of Any-Layer Via technology. Click here for fabrication issues that we have resolved.

Sample Boards


Stator Board
Mouse over pictures below to see description

               



SEC Blind and Buried Via Sample Boards



SFS Blind and Buried Vias Sample Boards: Click here