|1. Autonomous vehicles (LIDAR)||1. Desmear / Deash|
|2. Mobile||2. Hole preparation|
|3. Wireless||3. Cu plating / Cu filled via|
|4. Computing||Click here for more|
Via Fill and Any-Layer Via
HDI via fill plating boosts production time and increases density and functionality by providing finer lines and spaces. Combined with laser drilling, sequential lamination technology, and direct imaging, this plating process allows for the creation of any-layer via technology.
HDI sample circuit board: Cu Via Fill
Laser Drilled Blind and Buried Vias: Click here for more
Mouse over images and click for more information.