DefinitionBlind Vias start on an outer layer but terminate on an inner layer. Buried Vias exist only between inner layers and do not begin or terminate on an outer layer. Blind and buried vias save real estate as features and lines are designed above or below them without making a connection. Today's fine pitch BGA and flip-chip component footprints do not allow for traces.
ApplicationsHDI will be critical to the automotive industry by reducing the size necessary for LiDAR PCBs for autonomous vehicles.
Via Fill and Any-Layer ViaHDI via fill plating process dramatically reduces the number of steps required while at the same time allowing for smaller circuit line and spacing. Combined with laser drilling, sequential lamination technology, and direct imaging, this plating process allows for the creation of Any-Layer Via technology.
New HDI sample circuit board: Copper Via Fill.