DefinitionBlind Vias start on an outer layer but terminate on an inner layer. Buried Vias exist only between inner layers. Blind and buried vias save real estate as features and lines are designed above or below them without connection. Fine pitch BGA and flip-chip component footprints restrict traces.
ApplicationsHDI will be critical in reducing the size of LiDAR PCBs for autonomous vehicles. Mobile and wireless technology for Telecommunications and Computing drives the need for smaller vias with increased functionality.
Via Fill and Any-Layer ViaHDI via fill plating boosts production time and increases density and functionality by providing finer lines and spaces. Combined with laser drilling, sequential lamination technology, and direct imaging, this plating process allows for the creation of any-layer via technology.
HDI sample circuit board: Copper Via Fill
- Desemar and deash
- Hole preperation
- Copper plating and copper filled via
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