layers. Blind and buried vias save real estate. Features and lines designed above/below without connection. Fine pitch BGA and flip-chip component footprints restrict traces.| Applications | Fabrication issues |
| 1. Autonomous vehicles (LIDAR) | 1. Desmear / Deash |
| 2. Mobile | 2. Hole preparation |
| 3. Wireless | 3. Cu plating / Cu filled via |
| 4. Computing | Click here for more |
Via Fill and Any-Layer Via
HDI via fill plating boosts production time and increases density and functionality by providing finer lines and spaces. Combined with laser drilling, sequential lamination technology, and direct imaging, this plating process allows for the creation of any-layer via technology.
HDI sample circuit board: Cu Via Fill
Laser Drilled Blind and Buried Vias: Click here for more
Sample Boards
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