Saturn Electronics Logo
   
Laser Drilled Blind and Buried Vias

SEC's Mania Micronics drilling machines that utilize the latest in PCB Via Formation technology including linear X, Y, and Z drives, contact drilling sensing systems, and latest PLC instrumentation.

These advancements combine to allow for only a 0.5 mil z-axis tolerance, which enables us to use mechanical drilling for vias down to 4 mils in diameter and 4 mils deep (1:1 aspect ratio) without the use of more expensive, and rare, laser drilling systems.

Should you have blind via designs that are more aggressive than can be drilled on these latest technology mechanical drilling systems, we also have an in-house CO2 / YAG laser drilling system.


Voids: Desmear and DeAsh

To insure that blind vias are properly desmeared and deashed (if laser drilled), we utilize a two-step desmear process. This process first requires that the panels be submitted to a plasma conditioning process in our March Plasma System. We then process through a chemical desmear that has been optimized for micro- and blind vias. This line has been outfitted with long-stroke agitation and flight bar vibration to enhance fluid movement and prevent air bubble entrapment.

Voids: Hole Preparation

We have installed a Hollmuller Shadow hole preparation line that has been outfitted with advanced spray technologies. These spray technologies allow us to use this high-reliability hole preparation process for blind vias.

Voids: Copper Plating and Copper Filled Vias

Further, our copper plating lines have been outfitted with long-stroke agitation and flight bar vibration to enhance fluid movement and prevent air bubble entrapment. Our facility's Reverse Pulse Plating machine able to plate even the most aggressive designs. In addition, its copper filled vias capability ensure that your blind vias can also be used as via-in-pad technology. 













ul logo
View our UL Certification

Email Newsletter icon, E-mail Newsletter icon, Email List icon, E-mail List icon Sign up for our Email Newsletter