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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Blind / Buried Vias
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
Fine Pitch BGA

Fine Pitch BGA PCB
Layer Count 10
Copper Weight 1/2oz
Minimum Line and Space    4/4
Finish ENIG
Blind Vias L9-L10
Additional Details Via-in-Pad, Fine Pitch BGA

Fine Pitch BGA
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Technologies Used
Blind / Buried Vias
Fine Lines and Spacing