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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
Fine Pitch BGA


Fine Pitch BGA PCB
Layer Count 10
Copper Weight 1/2oz
Minimum Line and Space    4/4
Finish ENIG
Blind Vias L9-L10
Additional Details Via-in-Pad, Fine Pitch BGA



















Fine Pitch BGA
Mouse over pictures below to see description

         


Technologies Used
Blind / Buried Vias
Via-in-Pad
Fine Lines and Spacing