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Fine Lines
Common Issues: Edge Plating

Cu Peeling
Plating over a large substrate surface can lead to the plated copper peeling due to a lack of adhesion strength. We address this by first roughening the surface through a combination of chemical and other proprietary means. Next, we employ direct metallization, which has a higher copper bond strength, to prepare the surface for plating.

Often edge plating, especially on castellations, can result in burrs from the final machining process. We apply a modified, proprietary process flow that results in the burrs being polished down to the edge of the feature.

Edge Plating

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