ounce copper or higher in inner and/or outer layers of a printed circuit or power distribution board. Saturn is UL-Certified for up to 6-oz copper on inner and outer layers and capable of double-sided and multilayers up to 20 oz. Increasing the thickness of the copper trace as opposed to its width allows for higher-current carrying capacity as well as a higher density and a lower layer count. Moreover, its ability to conduct heat allows for thermal distribution and heat dissipation for large power components.| Applications | Fabrication issues |
| 1. High-power heat dissipation | 1. Delamination / resin voiding |
| 2. Planar transformers | 2. Inner layer alignment |
| 3. Power convertors | 3. Fabrication concerns with thinner materials |
| 4. Electric vehicle (EV) and photovoltaics (PV) | 4. Over-etching (anti-puddling) |
| 5. BMS (Flexible Heavy Cu) | 5. Etch factor / compensation |
| 6. High-voltage | Click here for more |
Heavy Cu Resource Center
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Sample Boards
