Saturn Electronics Logo
   
Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
RF PCB with Cavities


Microwave / Cavity PCB
Layer Count 4
Cu Weight 1/2oz
Min Line/Space 4/4
Final Finish ENIG
RO4003 Hybrid Stackup Cavity L3-4                    
Application RF / Microwave
Additional Details Controlled Impedance



















RF PCB with Cavities
Mouse over pictures below to see description

         


Technologies Used
Controlled Impedance
PTFE/Hybrid Technologies
Cavity Boards