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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Blind / Buried Vias
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
RF PCB with Cavities

Microwave / Cavity PCB
Layer Count 4
Cu Weight 1/2oz
Min Line/Space 4/4
Final Finish ENIG
RO4003 Hybrid Stackup Cavity L3-4                    
Application RF / Microwave
Additional Details Controlled Impedance

RF PCB with Cavities
Mouse over pictures below to see description


Technologies Used
Controlled Impedance
PTFE/Hybrid Technologies
Cavity Boards