This technology provides a cost-effective substitute for rigid-flex circuit
technology. This is garnered by eliminating the use of more expensive polyimide-based flexible substrates and a streamlined process flow requiring only one lamination cycle (no lamination at all for two-layers). The flexible portion is achieved by controlled-depth milling the FR4 material in the bend area. While this allows for multiple bend cycles (as shown in limited industry testing), we would recommend this technology for large radius, flex-to-install bends only. Sample Boards
Click on the board to see technical specifications and additional images.
Sample Semi Flex Boards
Semi Flex Circuit