Saturn Electronics Logo
   
Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Metal Core
Semi-Flex Circuits
Any-Layer Vias
Flexible Circuits
Variable Thickness, Soft Gold


Variable Thickness PCB
Layers
Min Ln / Sp 5 mil spacing
Final Finish Soft, Wire-Bondable Gold
Additional Details                                             FR4-06 (layers 1-4) and Teflon / TLY-5 (layers 5-6) hybrid. Layer pairs 1-2, 3-4, & 5-6 different height creating step pattern

















Variable Thickness
Mouse over pictures below to see description

           


Additional Advanced Technologies
Fine Lines and Spacing
Cavity Boards
Blind / Buried Vias