CAPABILITIES

Via-in-Pad


cta-via-microfill

Definition

Various definitions of via-in-pad can be found in IPC-4671. Typically, via in pad refers to a via that is plated through and then filled with a conductive (or non-conductive) epoxy plugging ink. The ink is then planarized to create a flat surface and plated over. Most commonly, this via will eventually be patterned into an SMT or BGA pad for soldering.

Applications

Via-in-Pad conserves real estate and also provides a direct conduit for heat transfer. Current fine pitch BGA and flip-chip component footprints prohibit running traces and vias (typical BGA configuration). Instead, the BGA pad, trace, and via are combined into one single feature allowing for 50% space savings. Conductive inks (electrical and thermal) transfer heat from critical components.

HDI Via FIll Plating Process

The HDI via fill plating process dramatically reduces the number of steps required while at the same time allowing for smaller circuit lines and spaces.
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Via Plugging Guideline

Summary chart of the different types of via plugs classified by IPC-4761 type, description, and material used. Page also features the various types of via plugging, a description of the via plugging process and our customers' most common concerns. 
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Fabrication Issues

Here you will find via-in-pad fabrication issues that we have resolved:

  •  Voids / dimples
  •  Planarity
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Sample Boards




Via-in-Pad Fine Pitch BGA
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Sample Via-in-Pad Boards




About Us

Domestic PCB Fabricator

Saturn Electronics Corporation is a debt-free, domestic bare printed circuit board manufacturer providing cutting-edge solutions mandatory throughout design, assembly and fabrication.

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