Various definitions of via-in-pad can be found in IPC-4671. Typically, via in pad refers to a via that ismicrovia-design-fabrication plated through and then filled with a conductive (or non-conductive) epoxy plugging ink. The ink is then planarized to create a flat surface before being plated over. Most commonly, this via will eventually be patterned into an SMT or BGA pad for soldering. Via-in-Pad conserves real estate and also provides a direct conduit for heat transfer. Current fine pitch BGA and flip-chip component footprints prohibit running traces and vias (typical BGA configuration). Instead, the BGA pad, trace, and via are combined into one single feature allowing for 50% space savings. Conductive inks (electrical and thermal) transfer heat from critical components.

Processes Fabrication issues
1.  HDI via fill plating 1.  Voids / dimples
2.  Via plugging 2.  Surface planarity
3.  VIPPO / POFV Click here for more

Sample Boards

Via-in-Pad Fine Pitch BGA
Mouse over pictures below to see description


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Domestic PCB Fabricator

Bare printed circuit board manufacturer (NAICS: 334412)
Romulus, MI (since 1985)
(734) 941-8100

BREAKING: DPA for PCBs: Defense Production Act prioritizes domestic circuit boards.

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