We have been producing PCBs with via-in-pad technology since 2002 and, along the way, have identified and addressed the most common root causes for yield loss.
Voids / Dimples
Through the use of vacuum tables and power squeegees, we have been able to fill up to 10:1 aspect ratio vias with no voiding.
Many of our competitors produce via-in-pads too infrequently to invest in equipment to planarize boards with the sufficient throughput and quality required for PCB Assembly. We have purchased and installed a Pola & Massa conveyorized planarizer that utilizes ceramic scrubbing rollers to ensure a high grade surface finish for via-in-pad applications.