Via-in-Pad Issues


We have been producing PCBs with via-in-pad technology since 2002 and, along the way, have identified and addressed the most common root causes for yield loss.

Voids / Dimples
Through the use of vacuum tables and power squeegees, we have been able to fill up to 10:1 aspect ratio vias with no voiding.

Surface Planarity
Many of our competitors produce via-in-pads too infrequently to invest in equipment to planarize boards with the sufficient throughput and quality required for PCB Assembly. We have purchased and installed a Pola & Massa conveyorized planarizer that utilizes ceramic scrubbing rollers to ensure a high grade surface finish for via-in-pad applications.

About Us

Domestic PCB Fabricator

Bare printed circuit board manufacturer (NAICS: 334412)
Romulus, MI (since 1985)
(734) 941-8100

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