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OSP
ENEPIG
ENIG
HASL
Pb-free HASL
Immersion Silver
Deep Gold
Immersion Tin
Soft, Wire Bondable Gold
Organic Surface Preservative

SEC provides OSP finish from domestic facility


What is OSP surface finish?

Organic Surface Preservative (OSP) is an organic solderability protectant process and provides a thin, uniform, non-tacky film capable of maintaining the solderability of the copper surface through multiple soldering thermal cycles. It has a slight pinkish tint color. The process is easily controlled and is more economical than metallic finishes that provide similar protection. The film thickness is essentially self-limiting and is easily controlled via the operating parameters.

What are the advantages of OSP?

  • Offers a flat, coplanar surface (similar to immersion finishes)
  • Less expensive than other immersion finishes.
  • Solderability is maintained through three I.R. soldering cycles
  • Reliable against moisture from a long term point of view
  • VOC free material
  • Lead-free applications

What are the disadvantages of OSP?

  • Could be easily decomposed by water dew and sweat, boards should be handled with gloves.
  • Visual inspection of OSP finish is virtually impossible.