Saturn Electronics Logo
   
Pb-free Resource Center
Metal Core Resource Center
PCB Design Tools
IPC Standards
Automotive
Fabrication Processes
PCB Basics
Final Finishes
PCB Basics

blind_via

Blind Via

Connects outer layer with inner layer; exposed only on one side of the board.

Buried Viaburied_via

Connect internal layers without being exposed on either surface.

Chip on Board

Integrated circuits glued and wire-bonded to boards (foregoing packaging) culminating in a Chip with fine wires bonded to both it and landing pads.

Liquid Photoimageable Solder Mask (LPI)

For purpose of controlling deposition, a mask is applied through use of photographic imaging techniques.

Plane

Copper layer connected to the ground that covers most of the board layer it inhabits.

Substrate

Surface adhesive substance spread for bonding or coating, this material (most commonly FR-4) is non-conductive carrier of copper traces.

Surface Finish

Also known as Final Finish, it is selected by the customer. The Assembly component process determines plating for the top and bottom layers. The different surface finishing processes are ENEPIG, ENIG, HASL, Pb-free HASL, OSP, Immersion gold, Immersion silver, and Deep Gold. Various factors considered during selection process include application and shelf life.

Trace

Copper strip used for carrying signal between two points on a circuit board. 
bare_board_basics
 

Via

Plated-through hole (PTH) between one or more layers for the purpose of transferring heat from top layer to inner and / or bottom layers connected to internal ground plane.